Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

Resultaten: 6
Selecteren Afbeelding Onderdeelnummer Fabrikant Omschrijving Gegevensblad Beschikbaarheid Prijsbepaling (EUR) De resultaten in de tabel met eenheidsprijs filteren op basis van uw hoeveelheid. Hvh. RoHS ECAD-model Product Lengte Breedte Hoogte
Advanced Thermal Solutions Koellichamen Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158In voorraad
Min.: 1
Veelv.: 1

Advanced Thermal Solutions Koellichamen Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 352In voorraad
Min.: 1
Veelv.: 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions Koellichamen maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93In voorraad
Min.: 1
Veelv.: 1

Advanced Thermal Solutions Koellichamen maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 104In voorraad
Min.: 1
Veelv.: 1

Advanced Thermal Solutions Koellichamen Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 86In voorraad
Min.: 1
Veelv.: 1

Advanced Thermal Solutions Koellichamen Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 29In voorraad
100Verwacht 27-3-2026
Min.: 1
Veelv.: 1