Bergquist TGP 2400 Highly Conformable S-Class GAP PAD® is a reinforced Gap Filling Material rated at 2.4W/m-K for thermal conductivity. It features low "S-Class" thermal resistance at ultra-low pressures for applications that typically use fixed standoff or clip mounting. The material is reinforced with fiberglass to resist puncture, shear, and tear. With protective liners provided over the inherent natural tack on both sides, Bergquist's TGP 2400 Highly Conformable S-Class GAP PAD® allows for stick-in-place characteristics during application assembly.
Thermal conductivity of 2.4W/m-K
Low "S-Class" thermal resistance at ultra-low pressures
Ultra conformable, "gel-like" modulus
Designed for low-stress applications
Fiberglass reinforced for puncture, shear, and tear resistance
Between processors and heat sinks
Areas where heat needs to be transferred to a frame, chassis, or other types of heat spreader