Bergquist Company TGP 6000ULM 6W/m-K, High Performance GAP PAD®

Bergquist Company TGP 6000ULM 6W/m-K, High-Performance GAP PAD® are soft gap-filling materials for high-performance applications requiring low assembly stress. These materials offer exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation. The 6000ULM series is highly conformal, even to surfaces with high roughness and/or topography, and allows for excellent interfacing and wet-out characteristics. This Bergquist Company TGP 6000ULM series features 6W/m·k thermal conductivity and operates in a -60°C to 200°C temperature range. These materials come with UL 94V-0 flammability rating.

Features

  • Outstanding thermal performance
  • Low stress
  • Ease of handling
  • High-tack and low-tack sides
  • High compliance
  • Reworkable
  • Excellent wet-out characteristics
  • High dielectric strength
  • Ultra-low modulus
  • Silicone technology

Applications

  • Telecommunications
  • ASICs and DSPs
  • Consumer electronics
  • Thermal module to heat sink assembly

Specifications

  • 6W/m∙K thermal connectivity
  • 41.3kPa Young's modulus
  • UL 94V-0 flammability rating
  • -60°C to +200°C operating temperature range
Gepubliceerd op: 2019-12-05 | Bijgewerkt op: 2023-06-09