
Bergquist Company TGP 3000 3W/m-K, Reinforced Soft S-Class GAP PAD®
Bergquist TGP 3000 3W/m-K, Reinforced Soft S-Class GAP PAD® features a thermal conductivity of 3W/m-K, providing exceptional thermal performance at low pressures. The material is supplied with protective liners on both sides, which have naturally inherent tack. TGP 3000 GAP PAD from Bergquist is ideal for high-performance, low-stress applications that would typically use fixed standoff or clip mounting. The conformable, yet elastic material offers excellent interfacing and wet-out characteristics.Features
- 3.0W/m-K thermal conductivity
- Low S-Class thermal resistance at very low pressures
- Highly conformable, S-Class softness
- Designed for low-stress applications
- Fiberglass reinforced for puncture, shear, and tear resistance
Applications
- Processors
- Server S-RAMs
- Mass storage drives
- Wireline / wireless communications hardware
- Notebook computers
- BGA packages
- Power conversion
Application Example

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Gepubliceerd op: 2011-10-07
| Bijgewerkt op: 2022-11-21