Nieuw D-Sub-kabels
Amphenol Commercial D-Sub Cable Assemblies offer EMI/RFI shielding, a rugged design, and secure mating, making them ideal for environments where reliability and signal integrity are crucial. The series features a current rating of up to 3A and wire gauges of 28AWG, 26AWG, 24AWG, and 20AWG, enabling designers to make selections based on current load, flexibility, and space constraints. Amphenol Commercial D-Sub Cable Assemblies operate within a temperature range of -20°C to +80°C and support moderate power applications. These robust and versatile connectors are ideal for electronics, industrial, and commercial environments. Typical applications include data, communications, instrumentation, set-top boxes, and medical instruments.
-
Amphenol D-Sub Cable AssembliesOffers EMI/RFI shielding, a rugged design, secure mating, up to 3A, and 28AWG to 20AWG wire gauges.6-1-2026
-
Winchester Interconnect M83513 Micro-D ConnectorsFeature a mechanically robust and durable rectangular form factor and low contact resistance.15-9-2025 -
L-Com Heavy Duty Deluxe D-Sub Cable AssembliesUtilizes 20AWG conductors, enabling maximum current throughput and an extremely durable assembly.14-12-2024 -
L-Com Data Interconnect SolutionsConsists of D-sub adapters, D-sub cable assemblies, and D-sub connectors.12-12-2024 -
Amphenol SnapLock-connectorenConsist of two connection cables and two connecting cables and are available in three lengths.26-11-2024 -
MicroStrain by HBK 3DM-GV7 Robuuste IMU’s van tactische kwaliteitVoorzien van een fijnbewerkte aluminium behuizing en getest volgens IP68.8-4-2024 -
TE Connectivity AMPLIMITE D-subminiatuur kabelmodulesOntworpen voor de Amlimite D-Subminiatuur connectorfamilie, die veel wordt gebruikt in elektronische industrieën.8-3-2024 -
Cinch Connectivity Solutions Space Screened Micro-D Cable AssembliesConforms to M83513 requirements and suitable for military, defense, and satellite applications.1-2-2024 -
Cinch Connectivity Solutions Micro-D Jumper AssembliesDesigned for rugged, high-performance, and densely compacted interconnect applications.28-8-2023